THE SMART TRICK OF MONOCRYSTALLINE SILICON THAT NO ONE IS DISCUSSING

Wire-saw wafer slicing is without doubt one of the crucial output technologies for industrial crystalline silicon PV cells, and improvements in wafer slicing engineering have resulted in a discount in raw wafer thickness from 370 μm to one hundred eighty μm considering that 1997 for Sharp industrial polycrystalline-silicon cells (Figure 6). To in